Product Category
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艾莱特电子有限公司
Domestic Marketing Dept
赵小姐
QQ:360206259
电话：0755-23283590
Alter Electronics Co.,Ltd
Overseas Sales Dept
Amy Zhao
Skype: pcb-amy
Peter Hu
Skype: pcb_peter
Vivian Wong
Kevin Cui
Skype: Kevinyhh
David Hu (G.M)
Components Sourcing
Alex.H
components1@alter-electronics.com
Alter Capability List
PCB Type:
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Blind and Buried vias
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Thick copper
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Selective hard gold plating
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Gold finger plating
Surface Finishing:
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Chemical immersion gold
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Chemical immersion silver
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HASL
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Flash(soft)gold over nickel
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Chemical immersion tin
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Carbon print
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OSP
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Peelable Mask
Technology Capability:
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Layers 2-30Layers
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Base material FR4,ROGERS,ARLON,TACONIC,Nelco
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Mini width/space 2.5mil/2.5mil
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Max Production Panel size 1100mmX610mm
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Final Board thickness 0.1-7.0mm
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Bow and twist 0.7%
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Mini.Laser Drill size 0.1mm
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HDI Design feature 1+N+1 with IVH
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Hole diameter tolerance for final product ±0.05mm
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Profile tolerance ±0.10mm
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Width of bridge with solder mask ≥0.08mm
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Solder mask plug via size 0.3mm-0.8mm
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Thick copper products Max 12oz
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Hole wall copper ≥20μм